JPS6239537B2 - - Google Patents

Info

Publication number
JPS6239537B2
JPS6239537B2 JP206680A JP206680A JPS6239537B2 JP S6239537 B2 JPS6239537 B2 JP S6239537B2 JP 206680 A JP206680 A JP 206680A JP 206680 A JP206680 A JP 206680A JP S6239537 B2 JPS6239537 B2 JP S6239537B2
Authority
JP
Japan
Prior art keywords
pattern
support tool
chip
substrate
half mirror
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP206680A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56100435A (en
Inventor
Osamu Tachibana
Tetsuo Noguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP206680A priority Critical patent/JPS56100435A/ja
Publication of JPS56100435A publication Critical patent/JPS56100435A/ja
Publication of JPS6239537B2 publication Critical patent/JPS6239537B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75753—Means for optical alignment, e.g. sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP206680A 1980-01-14 1980-01-14 Face-down bonder Granted JPS56100435A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP206680A JPS56100435A (en) 1980-01-14 1980-01-14 Face-down bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP206680A JPS56100435A (en) 1980-01-14 1980-01-14 Face-down bonder

Publications (2)

Publication Number Publication Date
JPS56100435A JPS56100435A (en) 1981-08-12
JPS6239537B2 true JPS6239537B2 (en]) 1987-08-24

Family

ID=11518962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP206680A Granted JPS56100435A (en) 1980-01-14 1980-01-14 Face-down bonder

Country Status (1)

Country Link
JP (1) JPS56100435A (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0687467B2 (ja) * 1987-10-31 1994-11-02 日本電気株式会社 ペレットボンディング装置
CN119404298A (zh) * 2022-07-11 2025-02-07 松下知识产权经营株式会社 定位装置、安装装置、定位方法以及安装方法

Also Published As

Publication number Publication date
JPS56100435A (en) 1981-08-12

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